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Disc type laser marking machine

Disc type laser marking machine
Applicable Materials / Fields
● High-volume, small-sized components
● Semi-finished products pre-arranged on specific trays
Product Features
● Can place hundreds or more parts on the tray at once
● Reduces manual loading/unloading time and improves production efficiency
● Easily supports zone-based marking on large trays
● Can be integrated with robotic arms for part handling
● Compatible with AB dual-station loading and unloading
Model No. |JBL-LMF Series
Application Overview |Supports different laser sources (e.g., CO2, fiber, UV) based on product types
Features |Customizable solutions for various environments. Low power consumption, low operating cost, low maintenance, high processing speed. Built-in vision alignment and auto code reading/recording.
Tray marking provides fast and accurate marking for small components in high quantities. Dual-axis platform supports automatic serial batch production, reducing manual loading time.
Specifications |Laser Power: 20/30/50W
Marking Area: 110×110mm, 175×175mm, 300×300mm
Engraving Speed: 5000 mm/s
Min. Line Width: 0.05mm
Power Supply: 110V/220V 60Hz
Cooling Method: Air-cooled
Power Consumption: ≦0.8KW
Dimensions: 800×650×1300mm
Industries |Automotive and motorcycle parts, IC electronic components, PCB circuit boards, general hardware, etc.






A demo machine is available on-site. For inquiries, please contact Chengbo Laser.
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