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Compound laser marking machine

Compound laser marking machine
Model No. |JBL-LMF Series
Application Overview |This model integrates large-area marking, tray marking, random part marking, and multi-position marking. Customizable based on application requirements.
Features |Equipped with a standard large 3-axis system and vision alignment. Enables synchronized marking to solve splicing issues. Tray marking allows fast and accurate processing—ideal for the electronics industry. Random part marking supports high-throughput production. Multi-station marking enables different products to be processed simultaneously, reducing line change time.
Specifications |Laser Power: 20/30/50W
Marking Area: 110×110mm, 175×175mm, 300×300mm
Engraving Speed: 5000mm/s
Min. Line Width: 0.05mm
Axis Range: X:400mm, Y:500mm, Z:300mm (customizable)
Power Supply: 3P 220V 60Hz
Cooling Method: Air Cooling
Power Consumption: ≦0.8KW
Machine Dimensions: 800×650×1500mm
Applications |Automotive components, bicycle industry, IC electronic parts, PCB boards, hardware and tools, etc.
  
A demo machine is available on-site. For inquiries, please contact Chengbo Laser.
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