● Minimum solder ball diameter: 0.1 mm
● Compatible with CCD positioning system for high-volume inline production
● Suitable for high-precision soldering with ±10 µm accuracy; minimum product pitch: 100 µm
● Wide range of solder ball sizes: Φ0.1 mm to 1.8 mm
● Applicable to surfaces coated with tin, gold, or silver, with a yield rate over 99%